Semiconductor Packaging : Materials Interaction and Reliability, Paperback by…
Semiconductor Packaging : Materials Interaction and Reliability, Paperback by Chen, Andrea; Lo, Randy Hsiao-yu, ISBN 113807540X, ISBN-13 9781138075405, Like New Used, Free shipping in the US This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.